Honor is reportedly working on its first clamshell-style foldable phone, which is tentatively dubbed the Honor Magic V Flip. Rumours are rife that the device will debut in June of this year in China. So far, a couple of mock renders have emerged on Weibo to showcase the design of the Magic V Flip. Now, a Chinese tech blogger has shared what appears to be the actual render of the device.
The leaker claims that the image shown above is the Rocco White edition of the Magic V Flip. As can be seen, the upper half of the back panel is completely occupied by the massive cover screen. However, there’s a round cutout for the camera module, which houses three camera sensors and an LED flash.
Unfortunately, the leak has no information about the specifications of the device. The only thing that is known about it is that it will be equipped with a 4,500mAh battery. Hopefully, other reports will shed more details about the device in the coming days.
Honor is currently focused on the launch of the Honor 200 series, which is set to go official on May 27 in China. The lineup will include two models, such as Honor 200 and 200 Pro. Both phones are expected to come equipped with the Snapdragon 7 Gen 3 Enhanced Version and the Snapdragon 8s Gen 3 chipsets, respectively.
After the Honor 200 series, the Magic V Flip may go official in June. In July, the brand is expected to announce the Snapdragon 8 Gen 3-powered Honor Magic V3 foldable phone.
